| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board by which a multilayer printed wiring board with a thick inner layer copper foil having an excellent characteristic such as thermal resistance can be manufactured without a trouble in molding. SOLUTION: In the method of the multilayer printed wiring board, a circuit is formed on at least one copper-clad plate, the plate is laminated with a plurality of prepregs and integrally molded, and a product of a multilayer printed wiring board and a cushion member are alternately combined and molded. The multilayer printed wiring board is obtained by this method of manufacturing the multilayer printed wiring board. COPYRIGHT: (C)2006,JPO&NCIPI |
