| 摘要 |
PROBLEM TO BE SOLVED: To provide the method of manufacturing a semiconductor device which can form a structure such as wiring constituting the semiconductor device, a display unit, and the like in a desired profile with a sufficient adhesiveness, which shows a small loss of a material, and which can attain a cost reduction. SOLUTION: A layer having a rough surface is formed. A region whose wettability to a composition comprising a conductive material is low and a region whose wettability to the composition is high are formed on the rough surface. A conductive layer is formed on the region whose wettability is high using the composition. Since it is possible to form a region whose wettability is largely different (a region having large difference in wettability), a liquid conductive material or an insulating material is correctly adhered only to the formed region. COPYRIGHT: (C)2006,JPO&NCIPI
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