发明名称 |
Noble metal contacts for micro-electromechanical switches |
摘要 |
A semiconductor micro-electromechanical system (MEMS) switch provided with noble metal contacts that act as an oxygen barrier to copper electrodes is described. The MEMS switch is fully integrated into a CMOS semiconductor fabrication line. The integration techniques, materials and processes are fully compatible with copper chip metallization processes and are typically, a low cost and a low temperature process (below 400° C.). The MEMS switch includes: a movable beam within a cavity, the movable beam being anchored to a wall of the cavity at one or both ends of the beam; a first electrode embedded in the movable beam; and a second electrode embedded in an wall of the cavity and facing the first electrode, wherein the first and second electrodes are respectively capped by the noble metal contact.
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申请公布号 |
US2006164194(A1) |
申请公布日期 |
2006.07.27 |
申请号 |
US20060358823 |
申请日期 |
2006.02.21 |
申请人 |
DELIGIANNI HARIKLIA;ANDRICACOS PANAYOTIS;BUCHWALTER L PAIVIKKI;COTTE JOHN M;JAHNES CHRISTOPHER;KRISHNAN MAHADEVAIYER;MAGERLEIN JOHN H;STEIN KENNETH;VOLANT RICHARD P;TORNELLO JAMES A;LUND JENNIFER |
发明人 |
DELIGIANNI HARIKLIA;ANDRICACOS PANAYOTIS;BUCHWALTER L. PAIVIKKI;COTTE JOHN M.;JAHNES CHRISTOPHER;KRISHNAN MAHADEVAIYER;MAGERLEIN JOHN H.;STEIN KENNETH;VOLANT RICHARD P.;TORNELLO JAMES A.;LUND JENNIFER |
分类号 |
H01H51/22;H01H59/00 |
主分类号 |
H01H51/22 |
代理机构 |
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