发明名称 Heat dissipation module
摘要 A heat dissipation module includes a first annular wall, a second annular wall, at least one porous structure, at least one first heat conductive structure and second heat conductive structure. The second annular wall with respect to the first annular wall, and the first annular wall and the second annular wall are jointed to form a closed chamber. The porous structure is disposed on an inner surface of the closed chamber. The first heat conductive structure is externally connected to the first annular wall and the second heat conductive structure is internally connected to the second annular wall.
申请公布号 US2006164809(A1) 申请公布日期 2006.07.27
申请号 US20050295530 申请日期 2005.12.07
申请人 DELTA ELECTRONICS, INC. 发明人 YU MIN-HUI;CHUANG MING-TE;LIN CHI-FENG;CHEN CHIN-MING
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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