发明名称 AUTOMATED SPUTTERING TARGET PRODUCTION
摘要 <p>A system and method are provided for manufacturing a sputtering target. The system is preferably automated. Sub systems of the manufacturing system include a robotic part handling sub system, a weighing sub system adapted to measure the weight of a part to be manufactured into a sputtering target, and a machining sub system adapted to finish machine a part to be manufactured into a sputtering target. The system can further include a cleaning sub system adapted to clean a part to be manufactured into a sputtering target, an inspection sub system adapted to measure dimensions of a part to be manufactured into a sputtering target, and a feedback control sub system adapted to provide control signals to one or more of the robotic handling sub system, the weighing sub system, the cleaning sub system, and the inspection sub system to control processing performed by one or more of the sub systems.</p>
申请公布号 WO2006078709(A2) 申请公布日期 2006.07.27
申请号 WO2006US01725 申请日期 2006.01.18
申请人 TOSOH SMD ETNA, LLC;REED, WILEY, ZANE;COSPER, BOBBY, R.;SCHMIDT, KENNETH, G.;BULTZ, NEIL, D.;WICKERSHAM, CHARLES, E., JR.;MATERA, JOHN, P. 发明人 REED, WILEY, ZANE;COSPER, BOBBY, R.;SCHMIDT, KENNETH, G.;BULTZ, NEIL, D.;WICKERSHAM, CHARLES, E., JR.;MATERA, JOHN, P.
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