| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing substrates that not only drastically improves adhesion force of wiring and reinforcing boards but also improves the workability of punching on the reinforcing board. SOLUTION: This method either applies liquid absorber 19 capable of laser beam (LB) absorption into a reinforming material 17 capable of laser beam (LB) transmission or provides a sheet-like absorption material 19. Next, the above-mentioned reinforcing material 17 is turned over on the wiring board 5 to become contact with the wiring board 5 via the absorber 19 and temporarily fixed. Then, the laser beam is irradiated (LB) onto the entire above-mentioned reinforcing material 17 to heat the above absorber 19 to weld the reinforcing material 17 and wiring board 5 for laser welding, and the laser-welded portion in a is cut into a desired shape by a process such as punching. COPYRIGHT: (C)2006,JPO&NCIPI
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