| 摘要 |
PROBLEM TO BE SOLVED: To provide a capacitor which is suitable especially for miniaturization and thinning, and which is superior in high-frequency characteristics and composite parts that use it. SOLUTION: At least one through-hole 10 is formed on a substrate 11, having conductivity, a dielectric layer 12 is formed on the inner wall of the through-hole 10, and an electrode 13, formed inside the through-hole 10 where the dielectric layer 12 is formed, the end of the substrate 11, is formed with one connection terminal 16 connected to the substrate 11, and at least one face of the electrode part 13 is formed with the other connection terminal 15. COPYRIGHT: (C)2006,JPO&NCIPI
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