| 摘要 |
PROBLEM TO BE SOLVED: To obtain a liquid sealing resin composition for an underfill, in which stresses in a resin are delocalized and cracks, warpage stress, etc., hardly occur by highly dispersing an inorganic filler and actualizing a uniform coefficient of linear expansion and modulus of elasticity. SOLUTION: The liquid sealing resin composition for underfill is obtained by mixing (A) an epoxy resin with (B) a curing agent, (C) a first coupling agent and (D) an inorganic filler having a surface chemically modified with a second coupling agent. One of the first coupling agent and the second coupling agent has an acidic group and the other has a basic group. COPYRIGHT: (C)2006,JPO&NCIPI
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