| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having reduced the stress at a ball electrode portion of a semiconductor package mounted on both surfaces of a printed wiring board and improved connection reliability. <P>SOLUTION: The semiconductor device has a printed wiring board 100, a first semiconductor package 1a having a first ball electrode group 10a and a first auxiliary ball electrode group 12a in a first arrangement region and an inner region and arranged on a first surface of the printed wiring board 100, and a second semiconductor package 1b having a second ball electrode group 10b and a second auxiliary ball electrode group 12b in a second arrangement region and an inner region and arranged on a second surface of the printed wiring board 100, wherein a ball electrode at least at a corner portion of the first ball electrode group 10a is arranged at a position in opposition to the second auxiliary ball electrode group 12b with the printed wiring board 100 sandwiched in between and a ball electrode at least at a corner portion of the second ball electrode group 10b is arranged at a position in opposition to the first auxiliary ball electrode group 12a with the printed wiring board 100 sandwiched in between. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
