| 摘要 |
FIELD: fluxes for soldering aluminum and its alloys. ^ SUBSTANCE: flux may be used as filler in tubular low melting lead-tin solders of given kinds. Flux contains, mass %: triethanolamine, 43 - 75; ammonium bifluoride, 25 - 50; acetamide, 0 - 7. Flux provides low temperature of aluminum surface activation in range 250 - 300°C, good spreadability of solder. ^ EFFECT: improved properties of flux, enhanced efficiency of soldering with use of such flux. ^ 1 tbl, 5 ex |
