HEAT SINK, RESISTOR, AND COOLING METHOD FOR RESISTOR (HEAT SINK FOR INTEGRATED CIRCUIT DEVICES)

摘要

PROBLEM TO BE SOLVED: To provide a resistor that has a heat sink with excellent heat conduction. SOLUTION: This heat sink includes a conduction path that has a high-thermal conductivity metal and other thermal conductors. In order that an electrical resistor may not be short-circuited to earth by this thermal resistor, a thin layer with a high-thermal conductivity electric insulator is interposed between the thermal conductor and the resistor's body. Accordingly, since heat is conducted to the heat sink in a direction in which the thermal conductor with high thermal conductivity moves away from the resistor, the resistor can pass a large amount of current. In addition to the fact that a parasitic capacitance and other electric parasitic actions that help reduce high-frequency responses from the electric resistor are lowered, various structures of a thermal conductor and heat sink are achieved through which favorable thermal conduction characteristics are obtained. COPYRIGHT: (C)2006,JPO&NCIPI