| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device in which the size can be reduced. <P>SOLUTION: The semiconductor device comprises a semiconductor chip 10 having electrodes 21 and 22 of first and second groups, and a wiring board 30 having interconnect lines 41 and 42 of first and second groups. The electrodes 21 are arranged along a first line 110, and the electrodes 22 are arranged along a second line 120. The interconnect line 41 has a first joint 43 and a first extension 45, and the wiring 42 has a second joint 44 and a second extension 46. The electrode 21 opposes the first joint 43 and the electrode 22 opposes the second joint 44. The second extension 46 is arranged contiguously to the first joint 43. The first joint 43 and the second joint 44 have the same width. The second extension 46 is narrower than the second joint 44, and the first extension 45 is wider than the second extension 46. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
