| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To correspond to multi-pin structure by pulling out some electrode pads of the principal surface of a semiconductor chip to a rear surface side. <P>SOLUTION: A circuit component not illustrated and a plurality of electrode pads 2a and 2b are provided to the principal surface of the semiconductor chip 1. The part of the electrode pad 2a is pulled output to the rear surface side of the semiconductor chip 1 through the penetration interconnection line 3, and connected with the back connection circuit pattern 5 of an interposer substrate 4. The electrode pad 2b which remains in the principal surface is connected to the front connection circuit pattern 6 by wire bonding 7. The electrode pads 2a and 2b of the semiconductor chip 1 are divided into the principal surface side and the rear surface side, and connected. Thus, the interconnect line on the interposer substrate 4 is utilized effectively, and the miniaturization of the device can be promoted. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
