| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a stable low wire loop shape and a wire loop shape with less damage in a neck height without causing a crushing mark of a wire by a capillary in a ball top of a first bonding point, and to provide a semiconductor device to which the wire loop shape is applied and a wire bonding method for forming the wire loop shape. <P>SOLUTION: In the wire loop shape where the first bonding point A and a second bonding point Z are connected by the wire 3, an entering part (h) of a part entered into the capillary during ball bonding of the first bonding point is tilted in the direction of the second bonding point. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
