| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress an increase in internal temperature by directly and efficiently conducting the heat of a heat-generating IC to a copper plate for heat generation. <P>SOLUTION: In electronic equipment furnished with a structure in which a heat radiating means with a high heat conductivity is arranged in a supporting means which supports an enclosure of the electronic equipment, a substrate or the like, a penetration part of prescribed dimensions is provided in the supporting means, and a first heat-conducting means is positioned in the penetrating part between a first heat-generating part arranged at the supporting means side and the heat-radiating means. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
