| 摘要 |
<P>PROBLEM TO BE SOLVED: To make a substrate assist white luminescence of LED while preventing the occurrence of curing inhibition of transparent resin and enabling solder to easily attach to the substrate. <P>SOLUTION: First, a land and a lead are formed in a predetermined position of a substrate 5 beforehand. In the front 5a of the substrate 5, resist containing a white paint is applied to a part for the nonformation part of the land. The substrate 5 is put into a warm air circulation furnace at temperature of 140°C so that white paint may be printed by heating the substrate 5 for 40 minutes. Next, solder resist is formed in the nonformation part of the land. Then, the coat of the solder layer is carried out to the substrate 5. Solder resist is removed and solder leveler is formed in the land. After forming the solder leveler, the substrate 5 is washed so as to remove the garbage and the dust on the substrate 5. Each LED4 and each of a pair of lands are connected by the reflow soldering method, and each LED4 is mounted in the substrate 5. Then, the substrate 5 is stored inside a case 2, and a panel 3 is fitted into the case 2. Finally, the inside of the case 2 is filled up with transparent resin 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
