| 摘要 |
PROBLEM TO BE SOLVED: To provide a capacitor device whose heat radiation performance is increased. SOLUTION: A case 42 is filled with an epoxy resin, or the like to ensure moisture resistance in a capacitor element 50 and to increase mechanical strength to vibration. A resin having a high thermal conductivity is filled into a bottom surface section in the case 42, namely a portion including the gap between a metal plate 54 and the case, for forming a resin section 48. When the powder of a material whose thermal conductivity is excellent is blended, the mechanical strength in the epoxy resin may be reduced. Therefore, a resin section 46 is formed at the upper portion of the resin section 48 to ensure the mechanical strength. The resin section 46 has the thermal conductivity worse than that of the resin section 48 but has the high mechanical strength. COPYRIGHT: (C)2006,JPO&NCIPI
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