发明名称 Photosensitive resin composition for black matrix
摘要 The present invention discloses a photosensitive resin composition for black matrix, which shows no undercut after development. The photosensitive resin composition comprises (A) an alkali-soluble resin, (B) a photopolymerizable monomer, (C) a photoinitiator, (D) a solvent, and (E) a black pigment; wherein the alkali-soluble resin (A) comprises a functional group having a general formula (a-1); (each R is independently H, linear or branch alkyl of C1-C5, phenyl, or halogen.) wherein a photoinitiator having a general formula (c-1) (Z<SUB>1 </SUB>is selected from the group consisting of Ra, Rb-S, Rc-O, wherein each of Ra, Rb, Rc is independently H, alkyl or aryl; Z<SUB>2 </SUB>is H, alkyl of C1-C4, or halide.), wherein the optical density value of black matrixis is greater than 2.0.
申请公布号 US2006166114(A1) 申请公布日期 2006.07.27
申请号 US20060386732 申请日期 2006.03.23
申请人 发明人 LEE CHUN-HSIEN
分类号 G03F1/00 主分类号 G03F1/00
代理机构 代理人
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