SPUTTERING SYSTEM AND FILM-FORMING METHOD

摘要

A sputtering system for forming a film on the surface of a disc-like substrate while rotating the substrate about the axis of rotation, which comprises a chamber, a table for rotating the substrate about the axis of rotation, and a sputtering cathode having a cathode surface arranged opposite to the substrate. This sputtering system is characterized in that the following relation is satisfied R:OF:TS=100:175:190±20; where R is the distance from the axis of rotation to the outer circumferential edge of the substrate, OF is the distance from the axis of rotation to the central point of the cathode surface, and TS is the height from the substrate surface to the central point of the cathode surface, and the axis of rotation intersects a normal passing the central point of the cathode surface at an intersection angle of 22°±2°.