| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a compact IC package in which a user's design and an adjusting period can be fairly reduced in a design method for designing an IC package using only a part of circuit blocks, and to provide its manufacturing method based on the IC package using a plurality of circuit blocks. <P>SOLUTION: In the method for designing the integrated circuit package, for an existing IC package 11 which has circuit blocks 1, 2 inside a package 11a and has a plurality of terminals containing a high frequency terminal connected to the circuit blocks 1, 2, the circuit block 2 is removed from the IC package 11. Also, the layout of the high frequency terminal connected to the circuit block 1 is not varied, and a part 6 related to a second circuit block in the package 11a is deleted, to design a new IC package 12 using only the circuit block 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
