| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact and inexpensive processing device capable of easily mapping workpieces in two or more places. SOLUTION: A washing processing device 100 which is one embodiment of the processing device is provided with a career placing part 1 for placing a career C for accommodating a wafer, a chamber 21 for washing the wafer, a holder 32a for performing carrying-in/out the wafer W to the chamber 21, a holder placing stage 33a for placing a holder 32a, a first hand 36a equipped with a sensor 39 for recognizing the wafer W, and one robot 31 which can freely attach and detach the first hand 36a. The robot 31 engages the first hand 36a so as to perform mapping the carrier C placed in a predetermined position of the career placing part 1 and the wafer in the holder 32a placed in the holder placing stage 33a. COPYRIGHT: (C)2006,JPO&NCIPI
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