| 摘要 |
PROBLEM TO BE SOLVED: To provide a conduction method between both surfaces of a substrate which has simple process for conducting both plate surfaces and may not thermally deteriorating the substrate, and to provide a wiring board. SOLUTION: Metallic particles 3 are filled in a hole (through hole) 2 formed on the substrate 1, and the metallic particles 3 are pressed in a thickness direction of the substrate 1. The metallic particles 3 are plastically deformed, pressed onto the inner wall of the hole 2, and fixed in the inside of the hole 2. Thus, conduction can be realized between both the surfaces of the substrate 1. COPYRIGHT: (C)2006,JPO&NCIPI
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