| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has excellent adhesive strengths to polyimide films without using a halogen-based flame retardant, and to provide a prepreg using the same. SOLUTION: This thermosetting resin composition comprises (A) a dihydrobenzoxazine ring-having compound, (B) a modified phenolic resin prepared by polycondensing a phenol compound and a triazine ring-having compound with an aldehyde compound, (C) a thermosetting resin, and (D) a phosphinate represented by the general formula (I) [R<SP>1</SP>and R<SP>2</SP>are each independently a linear or branched 1 to 6C alkyl or aryl; M is at least one metal selected from the group consisting of Mg, Ca, Al, Sb, Sn, Ge, Ti, Zn, Fe, Zr, Ce, Bi, Sr, Mn, Li, Na and K; (m) is an integer of 1 to 4]. COPYRIGHT: (C)2006,JPO&NCIPI
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