CROSSLINKED POLYOLEFIN RESIN COMPOSITION FOR USE IN MOLDED ARTICLE, AND MOLDED CIRCUIT COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a crosslinked polyolefin resin composition which offers the high adhesiveness to the metal membrane obtained by the forming treatment without impairing the relative dielectric constant at a high frequency bandwidth, dielectric dissipation factor, flowability and thermal resistance of a crosslinked polyolefin resin composition and to provide a molded circuit component using the composition. SOLUTION: The crosslinked polyolefin resin composition for use in molded articles contains 33-96% by weight of (A) a crosslinked polyolefin resin of the graft copolymer composed of 5-95% by weight of a nonpolarα-olefin-based (co)polymer segment and/or a nonpolar conjugated diene-based (co)polymer segment and 5-95% by weight of a vinyl aromatic (co)polymer segment and 4-67% by weight of (B) a glass-based filler. COPYRIGHT: (C)2006,JPO&NCIPI