发明名称 SILICONE COMPOSITION FOR ENCAPSULATING LUMINESCENT ELEMENT AND LUMINESCENT DEVICE
摘要 A silicone composition for encapsulating luminescent elements which comprises: (A) a vinylated organopolysiloxane of a three-dimensional network structure represented by the average rational formula (SiO<SUB>4/2</SUB>)<SUB>a</SUB>(ViR<SUB>2</SUB>SiO<SUB>1/2</SUB>)<SUB>b</SUB>(R<SUB>3</SUB>SiO<SUB>1/2</SUB>)<SUB>c</SUB> (wherein Vi represents vinyl; R's are the same or different and each represents an (un)substituted monovalent hydrocarbon group other than alkenyl; and a, b, and c each is a positive number, provided that 0.2=a/(a+b+c)=0.6 and 0.001=b/(a+b+c)=0.2); (B) an organohydrogenpolysiloxane which has at least two silicon-bonded hydrogen atoms per molecule and is contained in such an amount that the amount of the silicon-bonded hydrogen atoms is 0.3-3.0 mol per mol of the silicon-bonded vinyl groups in the ingredient (A); and (C) a hydrosilylation catalyst (catalytic amount). The composition after curing has a coefficient of linear expansion of 10×10<SUP>-6</SUP> to 290×10<SUP>-6</SUP> per °C. This composition can give a cured object which enables itself and the base to have a reduced residual stress and thereby retains satisfactory and stable adhesiveness over long.
申请公布号 WO2006077667(A1) 申请公布日期 2006.07.27
申请号 WO2005JP13451 申请日期 2005.07.22
申请人 GE TOSHIBA SILICONES CO., LTD.;MOCHIZUKI, KIKUO;HIRAI, NOBUO 发明人 MOCHIZUKI, KIKUO;HIRAI, NOBUO
分类号 C08L83/07;C08L83/05;H01L23/29;H01L23/31;H01L33/56 主分类号 C08L83/07
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