发明名称 Light emitting diode and fabricating method thereof
摘要 A light emitting diode and the method of the same are provided. A light emitting diode epitaxy structure is formed on a substrate, and then the light emitting diode epitaxy structure is etched to form a recess. The recess is then filled with a transparent dielectric material. An ohmic contact layer and a reflective layer are formed sequentially, and then are etched to expose the transparent dielectric material. Finally, forming an adhesive conductive complex layer to fix the ohmic contact layer and the reflective layer on the light emitting diode epitaxy structure.
申请公布号 US2006163599(A1) 申请公布日期 2006.07.27
申请号 US20050108966 申请日期 2005.04.19
申请人 UNITED EPITAXY COMPANY, LTD. 发明人 TSAI TZONG-LIANG;WEN WAY-JZE;CHIANG CHANG-HAN;CHANG CHIH-SUNG
分类号 H01L29/22;H01L33/38;H01L33/46 主分类号 H01L29/22
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