发明名称 |
Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same |
摘要 |
A resin-encapsulated semiconductor device includes a semiconductor chip, a plurality of inner leads that are connected to a group of electrodes of the semiconductor chip, respectively, and an encapsulating resin that encapsulates a connection part located between the semiconductor chip and the inner leads. Each of the inner leads includes a protruded portion provided on a surface thereof on an outer side relative to the periphery of the semiconductor chip. The protruded portion protrudes in a thickness direction and is provided with a step portion formed in its side portion. The group of electrodes of the semiconductor chip is connected to surfaces of inner portions of the inner leads located on an inner side relative to their protruded portions, through electroconductive bumps, respectively. The encapsulating resin encapsulates the semiconductor chip and the electroconductive bumps and is formed to expose surfaces of the protruded portions. The surfaces of the protruded portions that function as external terminals can be reduced in size and thereby the pitch between the external terminals can be reduced.
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申请公布号 |
US2006163703(A1) |
申请公布日期 |
2006.07.27 |
申请号 |
US20060390019 |
申请日期 |
2006.03.27 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MINAMIO MASANORI;HORIKI HIROSHI;FUKUDA TOSHIYUKI |
分类号 |
H01L23/495;H01L25/18;H01L21/56;H01L23/31;H01L23/50;H01L25/065;H01L25/07;H01L25/10 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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