发明名称 CONCATENATED BODY OF SENSOR CHIPS AND MANUFACTURING METHOD THEREOF
摘要 <p>In a concatenated body of sensor chips, adjacent sensor chips are concatenated in such a way that they can be separated. Each of the sensor chips can effectively be cut off and separated from the concatenated body and after the separation, the sensor chip can easily and rapidly be contained in a container. Furthermore, it is possible to easily inspect the sensor chips and exclude a defective chip. Each of the sensor chips includes a substrate, a cover layer, a hallow reaction unit arranged between the substrate and the cover layer, detection means arranged in the hollow reaction unit, an output terminal for outputting a signal detected by the detection means, and a sample introduction opening for introducing a sample into the hollow reaction unit. The manufacturing method of the concatenated body of sensor chips is also disclosed.</p>
申请公布号 WO2006078016(A1) 申请公布日期 2006.07.27
申请号 WO2006JP300966 申请日期 2006.01.23
申请人 SUMITOMO ELECTRIC INDUSTRIES, LIMITED;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCEAND TECHNOLOGY;KAIMORI, SHINGO;HOSOYA, TOSHIFUMI;ICHINO, MORIYASU;NAKAMURA, HIDEAKI;GOTOH, MASAO;KURUSU, FUMIYO;ISHIKAWA, TOMOKO;KARUBE, ISAO 发明人 KAIMORI, SHINGO;HOSOYA, TOSHIFUMI;ICHINO, MORIYASU;NAKAMURA, HIDEAKI;GOTOH, MASAO;KURUSU, FUMIYO;ISHIKAWA, TOMOKO;KARUBE, ISAO
分类号 G01N27/327;G01N35/02 主分类号 G01N27/327
代理机构 代理人
主权项
地址
您可能感兴趣的专利