| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring method for enhancing reliability. <P>SOLUTION: A first wiring board 42 having conduction patterns 14, 16, 18, and a substrate 44 having an opening 46 across which the conduction patterns 14, 16, 18 are formed is prepared. The conduction patterns 14, 16, 18 of the first wiring board 42 are connected electrically with an electrode 28 formed on a second wiring board in the opening 46. The first wiring board 42 is separated into a plurality of sections. Separation of the first wiring board 42 includes cutting at least a part of the conduction patterns 14, 16, 18 in the opening 46. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
