| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device, designed to form multi-layers containing at least one active layer on the front side of a substrate composed of a semiconductor material, thereafter, at least partially remove the substrate thus formed, and then join the multi-layers to a hetero-substrate. <P>SOLUTION: A substrate is removed in a selective etching agent for a material of the substrate by wet chemical etching, and a first metal contact layer 7 is applied to the back side 6 of multi-layers 2, 3, 4, 5 facing the front side of the removed substrate, and a second metal contact layer 10 is applied to the front side 8 of a hetero-substrate 9. The back side 6 of the multi-layers 2, 3, 4, 5 thus covered is jointed to the front side 8, covered with layers 10 of the hetero-substrate 9 by an amorphous coupling under the action of heat. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
