发明名称 METHOD FOR PRODUCING EPOXY RESIN COMPOSITION FOR OPTICAL SEMI-CONDUCTOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for producing an epoxy resin composition which has both transparency and mold releasability, has excellent adhesiveness, and is used for optical semi-conductors, and to provide a semi-conductor using the same. <P>SOLUTION: This method for producing the epoxy resin composition which is used for optical semi-conductors and contains an epoxy resin (A), an acid anhydride curing agent (B), an alcohol (C) having two hydroxyl groups in the molecule, a mold release agent (D) having a specific structure, and a dispersing agent (E) as main components is characterized by having a process for preliminarily melt-mixing the components (A) to (E) and a process for mixing and kneading the melt-mixed main components with components except the main components. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006193566(A) 申请公布日期 2006.07.27
申请号 JP20050004555 申请日期 2005.01.11
申请人 SUMITOMO BAKELITE CO LTD 发明人 MAEDA SHIGEYUKI
分类号 C08G59/42;C08G59/62;C08K5/06;C08L63/00;H01L23/29;H01L23/31;H01L33/56 主分类号 C08G59/42
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