| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of chip-size in which the reliability of packaging is improved by improving soldering in packaging. SOLUTION: The semiconductor device comprises a base portion 11 composed of a rectangular metal plate, a metal base 10 provided with connection electrodes 15 arranged in both sides portions 12 formed in the both sides of the base portion 11, and a semiconductor chip 1 mounted on the base portion 11 of the metal base 10, wherein the packaging is performed using electrodes 7 and 8 which are formed on the surface of the semiconductor chip 1 and connection electrodes 15. The surface height of the connection electrodes 15 are made higher than that of the electrodes 7 and 8 of the semiconductor chip 1 by a given dimension. When mounted in the packaging substrate face down, the semiconductor chip 1 does not touch the packaging substrate preventing the semiconductor chip 1 to be mechanically damaged, and further a soldering layer is formed with configured minute spacing between the electrodes 7 and 8 and the packaging substrate, thereby the reliability of the soldering is enhanced. COPYRIGHT: (C)2006,JPO&NCIPI |
