发明名称 SPLIT LAMINATED WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a split laminated wiring board which is stabilized in electric characteristics, with little generation of curvature and without mounting expensive parts, such as a chip capacitor. <P>SOLUTION: In the split laminated wiring board wherein a first wiring board 1 is mounted in a second wiring board 31, the second wiring board 31 is mounted to a printed circuit board 51. A capacitor 7 is formed in the first wiring board 1, and furthermore, the dielectric constant of the first wiring board 1 is larger than the dielectric constant of the second wiring board 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006196673(A) 申请公布日期 2006.07.27
申请号 JP20050006549 申请日期 2005.01.13
申请人 KYOCERA CORP 发明人 FURUKUBO YOJI
分类号 H05K3/46 主分类号 H05K3/46
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