Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor

摘要

A hybrid electronic circuit package ( 102, FIG. 1 ) includes non-insertable conductive features ( 110 ) and insertable conductive features ( 112 ) at a surface of the package. A hybrid receptacle ( 120 ), such as a socket, for example, includes non-insertable contacts ( 124 ) and insertable contacts ( 126 ), which are positioned in a complementary manner with the non-insertable and insertable features of the package. A vertical securement device ( 132, 134, 136 ) applies a vertical compressive force to the package ( 102 ) to compress the non-insertable features ( 110 ) against the non-insertable contacts ( 124 ). Further, a normal force securement device can be used to provide a sustained normal force to compress the insertable features and contacts together. In one embodiment, the non-insertable features are land grid array lands and the insertable features are low insertion force features.