发明名称 SYSTEMS AND METHODS FOR VOLTAGE DISTRIBUTION VIA MULTIPLE EPITAXIAL LAYERS
摘要 Systems and methods for voltage distribution via multiple epitaxial layers. In accordance with a first embodiment of the present invention, an integrated circuit comprises <SUP>-</SUP>a wafer substrate of a connectivity type. A first epitaxial layer of a connectivity type is disposed upon a second epitaxial layer of an opposite connectivity type, which is disposed upon the wafer substrate.
申请公布号 WO2006055639(A3) 申请公布日期 2006.07.27
申请号 WO2005US41541 申请日期 2005.11.07
申请人 TRANSMETA CORPORATION;MASLEID, ROBERT, PAUL 发明人 MASLEID, ROBERT, PAUL
分类号 H01L21/8238;H01L27/092 主分类号 H01L21/8238
代理机构 代理人
主权项
地址