发明名称 |
SYSTEMS AND METHODS FOR VOLTAGE DISTRIBUTION VIA MULTIPLE EPITAXIAL LAYERS |
摘要 |
Systems and methods for voltage distribution via multiple epitaxial layers. In accordance with a first embodiment of the present invention, an integrated circuit comprises <SUP>-</SUP>a wafer substrate of a connectivity type. A first epitaxial layer of a connectivity type is disposed upon a second epitaxial layer of an opposite connectivity type, which is disposed upon the wafer substrate. |
申请公布号 |
WO2006055639(A3) |
申请公布日期 |
2006.07.27 |
申请号 |
WO2005US41541 |
申请日期 |
2005.11.07 |
申请人 |
TRANSMETA CORPORATION;MASLEID, ROBERT, PAUL |
发明人 |
MASLEID, ROBERT, PAUL |
分类号 |
H01L21/8238;H01L27/092 |
主分类号 |
H01L21/8238 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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