发明名称 Solid state imaging device, semiconductor wafer and camera module
摘要 <p>A light-permeable lid provided oppositely to a photodetector of a solid-state imaging element includes a glass substrate, and an infrared-ray shielding film formed on one side of the glass substrate. The light-permeable lid is disposed so that the side of the light-permeable lid (glass substrate) forming the infrared-ray shielding film is positioned at the opposite side of the side facing the photodetector of the solid-state imaging element. If dust mixes in the infrared-ray shielding film or dust deposits to the film, since the distance from the photodetector to dust (infrared-ray shielding film) is longer, the photodetector is less susceptible to adverse influence of the dust and occurrence of defect due to the dust can be decreased. </p>
申请公布号 EP1603165(A3) 申请公布日期 2006.07.26
申请号 EP20050253352 申请日期 2005.06.01
申请人 SHARP KABUSHIKI KAISHA 发明人 UCHIDA, KENJI
分类号 H01L27/14;H01L27/146;H01L31/0203;H04N5/225;H04N5/335;H04N5/372;H04N5/374 主分类号 H01L27/14
代理机构 代理人
主权项
地址