发明名称 Connector terminal fabrication process and connector terminal
摘要 <p>An upper tier terminal is provided with a fitting portion and a board attachment portion. When the upper tier terminal is being fabricated, a first wire member which is a component of the fitting portion and a second wire member which is a component of the board attachment portion, whole peripheral surfaces of which have been subjected to a plating treatment beforehand, are employed. End portions of the first wire member and the second wire member are mutually superposed, and the first wire member and the second wire member are joined. Thus, the fitting portion is formed and the board attachment portion is formed. Hence, a surface of the upper tier terminal is structured by a plating layer at the peripheral surface of the first wire member and a plating layer at the peripheral surface of the second wire member. Consequently, a post-plating treatment can be rendered unnecessary.</p>
申请公布号 EP1684391(A2) 申请公布日期 2006.07.26
申请号 EP20060000936 申请日期 2006.01.17
申请人 KABUSHIKI KAISHA TOKAI-RIKA-DENKI-SEISAKUSHO 发明人 MATSUOKA, KATSUMASA;KATO, YOSHIAKI;SASAKI, HAREHIDE
分类号 H01R12/55;H01R43/16;H01R13/03;H01R43/02;H01R43/20 主分类号 H01R12/55
代理机构 代理人
主权项
地址