发明名称 CONDUCTIVE PASTE AND MULTILAYER CERAMIC SUBSTRATE
摘要 <p>An electrically conductive paste used for forming wiring conductors, such as via holes (15) disposed on a multilayer ceramic substrate (11), is provided, wherein the temperature range, in which sintering is effected in a firing step, can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a grass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers (12) included in the multilayer ceramic substrate (11) in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150?C to 300?C lower than the above-described sintering temperature.</p>
申请公布号 EP1684559(A1) 申请公布日期 2006.07.26
申请号 EP20040818474 申请日期 2004.11.10
申请人 MURATA MANUFACTURING CO., LTD. 发明人 NOMIYA, MASATO;URAKAWA, JUN
分类号 H05K1/09;H01B1/16;H01L23/498;H05K3/40;H05K3/46 主分类号 H05K1/09
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