发明名称 |
High flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate |
摘要 |
A center hole with a slanted reflective side wall, is provided in a cover (17) attached to a base substrate (11). A transparent resin (18) fills the hole and seals a flip-chip light emitting diode chip (16) provided within the hole. The base substrate is divided into two portions that connect the electrodes of the chip.
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申请公布号 |
GB2383681(B) |
申请公布日期 |
2006.07.26 |
申请号 |
GB20010031089 |
申请日期 |
2001.12.31 |
申请人 |
UNITED EPITAXY COMPANY, LTD.;EPISTAR CORPORATION |
发明人 |
TZER-PERNG CHEN |
分类号 |
H01L33/48;H01L33/64 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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