| 发明名称 |
Semiconductor packaging structure |
| 摘要 |
A housing (30) for a semiconductor element (72) comprises a substrate (32) connected to an attachment surface of a circuit board on one side (46) with a recess (48) in this side containing a semiconductor piece (34). The other side of the semiconductor opposite to the attaching surface is attached to the substrate at a section (74). |
| 申请公布号 |
GB2396963(B) |
申请公布日期 |
2006.07.26 |
| 申请号 |
GB20030026399 |
申请日期 |
2003.11.12 |
| 申请人 |
AGILENT TECHNOLOGIES, INC. |
发明人 |
SAI-MUN LEE;GURBIR SINGH;CHENG WHY TAN |
| 分类号 |
H01L23/055;H01L23/12;H01L23/02;H01L23/36;H01L23/498;H01L31/02;H01L33/56;H01L33/62;H01L33/64 |
主分类号 |
H01L23/055 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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