Liquid cooled thermosiphon for electronic components

摘要

A fluid heat exchanger assembly cools an electronic device (30) with a cooling fluid supplied from a heat extractor (R, F) to an upper portion (26) of a housing (20). A refrigerant is disposed in a lower portion (28) of the housing (20) for liquid-to-vapor transformation. A partition (32) divides the upper portion (26) of the housing (20) from the lower portion (28) and flow interrupters (34) are disposed in the upper portion (26) for interrupting thermal boundary layer to enhance thermal heat transfer to the flow of liquid coolant through the coolant passage (33) of the upper portion (26) in response to heat transferred by an electronic device (30) to the lower portion (28) of the housing (20).