A resin encapsulated device and method of manufacture

摘要

A resin encapsulated device (1) comprising a housing (2) defining a hollow body, a sensitive component (4) at least partly located within the housing, a resin material provided within the housing to at least partially encapsulate the component, characterised by a rigid buffer element (5) embedded within the resin material adjacent at least one component to prevent the origination of cracks within the resin material and/or to prevent cracks which might propagate within the resin material from reaching the component.