发明名称 |
Wiring board and method of fabricating tape-like wiring substrate |
摘要 |
A substrate supporting a plurality of interconnecting patterns arranged in matrix is cut at a position at least between adjacent columns of the interconnecting patterns. A plurality of positioning marks are formed on the substrate and arranged on a straight line between adjacent columns of the interconnecting patterns. Cutting of the substrate is performed by using the positioning marks as reference.
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申请公布号 |
US7081590(B2) |
申请公布日期 |
2006.07.25 |
申请号 |
US20030370289 |
申请日期 |
2003.02.19 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
YUZAWA HIDEKI |
分类号 |
H05K1/00;H01L23/498;H01L23/544;H05K1/02;H05K3/00;H05K3/24;H05K13/06 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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