发明名称 |
Solder mask removal method |
摘要 |
A printed circuit board has a circuit trace on it and a solder mask over the circuit trace. The solder mask is removed from the printed circuit board using an ultra violet laser, to expose the circuit trace without damaging the circuit trace. A failure analysis is performed on the circuit trace of the printed circuit board.
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申请公布号 |
US7081209(B2) |
申请公布日期 |
2006.07.25 |
申请号 |
US20030616156 |
申请日期 |
2003.07.09 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
KUO YIAN-LIANG |
分类号 |
G01L21/30;H05K1/02;H05K3/00;H05K3/22;H05K3/28 |
主分类号 |
G01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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