| 摘要 |
PURPOSE: The method simplifies the whole fabrication process and reduces the fabrication time. CONSTITUTION: The semiconductor package comprises: a semiconductor chip(11); a heat sink loaded with the semiconductor chip on its surface; a lead frame(13) which is installed to the heat sink and is formed with a plating layer over the whole surface; a thermoplastic both-sided tape(14) bonding the heat sink and the lead frame; a gold wire(16) connecting an electrode of the semiconductor chip with the lead frame; and a mold(15) wrapping the semiconductor chip and the inner lead part of the lead frame. The method fabricates the package within a relatively fast time without additional process as to the attachment adhesion layer between the heat sink and the lead frame. |
