发明名称 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package |
摘要 |
A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die including a first surface and a second surface, and a leadframe structure having a die attach region and a plurality of leads extending away from the die attach region. The die attach region includes one or more apertures. A molding material is around at least portions of the die attach region of the leadframe structure and the semiconductor die. The molding material is also within the one or more apertures. |
申请公布号 |
US7081666(B2) |
申请公布日期 |
2006.07.25 |
申请号 |
US20050051061 |
申请日期 |
2005.02.04 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
JOSHI RAJEEV;WU CHUNG-LIN |
分类号 |
H01L23/495;H01L21/60;H01L23/28 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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