发明名称 |
COMPOSITION FOR FORMING LOW DIELECTRIC FILM COMPRISING POLYMERIC NANOPARTICLES AND METHOD FOR PREPARING LOW DIELECTRIC THIN FILM USING THE SAME |
摘要 |
<p>A composition for forming a low dielectric thin film, which includes a silane polymer, polymer nanoparticles, a porogen and an organic solvent, and a method of preparing a low dielectric thin film using the same. The low dielectric thin film prepared using the composition of this disclosure has a low dielectric constant and excellent mechanical strength. As well, the polymer nanoparticles in the low dielectric thin film have a uniform diameter and are soft, and thus are advantageously applied to a chemical-mechanical polishing process.</p> |
申请公布号 |
KR20060084659(A) |
申请公布日期 |
2006.07.25 |
申请号 |
KR20050005435 |
申请日期 |
2005.01.20 |
申请人 |
SAMSUNG CORNING CO., LTD. |
发明人 |
LEE, JIN GYU;JEONG, HYUN DAM;SEON, JONG BAEK |
分类号 |
H01B3/46 |
主分类号 |
H01B3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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