发明名称 COMPOSITION FOR FORMING LOW DIELECTRIC FILM COMPRISING POLYMERIC NANOPARTICLES AND METHOD FOR PREPARING LOW DIELECTRIC THIN FILM USING THE SAME
摘要 <p>A composition for forming a low dielectric thin film, which includes a silane polymer, polymer nanoparticles, a porogen and an organic solvent, and a method of preparing a low dielectric thin film using the same. The low dielectric thin film prepared using the composition of this disclosure has a low dielectric constant and excellent mechanical strength. As well, the polymer nanoparticles in the low dielectric thin film have a uniform diameter and are soft, and thus are advantageously applied to a chemical-mechanical polishing process.</p>
申请公布号 KR20060084659(A) 申请公布日期 2006.07.25
申请号 KR20050005435 申请日期 2005.01.20
申请人 SAMSUNG CORNING CO., LTD. 发明人 LEE, JIN GYU;JEONG, HYUN DAM;SEON, JONG BAEK
分类号 H01B3/46 主分类号 H01B3/46
代理机构 代理人
主权项
地址
您可能感兴趣的专利