发明名称 |
Method for manufacturing an electronic component |
摘要 |
A method of manufacturing an electronic component with a contact having a terminal section for brazing and a contact section includes steps that construct a contact base member of a material that is poorly wettable, forms a primer plating layer of a material that is poorly wettable to the weld brazing material on the base member, forms a finish plating layer of a material that is highly wettable to the weld brazing material on the primer plating layer, and selectively removes a portion of the finish plating layer to obtain an exposed region of the primer plating layer that serves as an arresting region for arresting the weld brazing material from creeping up and migrating along the highly wettable finish plating layer in brazing the terminal section to the brazing pad of a wiring board.
|
申请公布号 |
US7080451(B2) |
申请公布日期 |
2006.07.25 |
申请号 |
US20030723102 |
申请日期 |
2003.11.26 |
申请人 |
JAPAN AVIATION ELECTRONICS INDUSTRY LIMITED |
发明人 |
SAITO KAZUHISA;HOSODA ASUKA;AKIMOTO HIROSHI |
分类号 |
H01R43/16;H01R4/02;H05K3/34 |
主分类号 |
H01R43/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|