| 摘要 |
An electronic apparatus has a housing, a heat generating component arranged in the housing, a heat pipe including a flat heat receiving surface integrally formed at one end, a deformable thermal conductive material, and a heat radiation member. The deformable thermal conductive material is arranged between the flat heat receiving surface and the heat generating component, and thermally connects the flat heat receiving surface and the heat generating component. The heat radiation member is thermally connected to the other end of the heat pipe. |
