发明名称 |
Polishing apparatus and polishing pad |
摘要 |
A polishing pad ( 10 ) has an upper-layer pad ( 11 ) having a hole ( 11 a) defined therein, a light-transmittable window ( 41 ) disposed in the hole ( 11 a) for allowing light to pass therethrough, and a lower-layer pad ( 12 ) disposed below the upper-layer pad ( 11 ) and having a light passage hole ( 12 a) defined therein which has substantially the same diameter as the hole ( 11 a) in the upper-layer pad ( 11 ). A transparent film ( 13 ) with an adhesive agent applied to upper and lower surfaces thereof is interposed between the upper-layer pad ( 11 ) and the lower-layer pad ( 12 ). The hole ( 11 a) defined in the upper-layer pad ( 11 ) and the light passage hole ( 12 a) defined in the lower-layer pad ( 12 ) have substantially the same size as each other. |
申请公布号 |
US7081044(B2) |
申请公布日期 |
2006.07.25 |
申请号 |
US20030450647 |
申请日期 |
2003.06.16 |
申请人 |
EBARA CORPORATION |
发明人 |
OHTA SHINRO;SHIMIZU KAZUO |
分类号 |
B24B1/00;B24B37/00;B24B37/013;B24B37/04;B24B37/20;B24B37/22;B24B37/24;B24D7/12;B24D11/00;H01L21/304;H01L21/306 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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